AirCool Chuck System
AirCool utilizes pressurized air inside the chuck to cool.

• No liquids and peltier elements
• MTBF > 35,000 hours
• Temperature ranges
  from -30 to +400 °C

AirCool plus Chuck System
Revolutionary system with a minimum footprint.

• No liquids and peltier elements
• Patented Chuck/Chiller combination
• Temperature ranges
  from -65 to +300 °C

PowerSense Chuck System
The Answer to ever faster and smaller semiconductors.

• Up to 5000W energy dissipation
• Most efficient heat transfer
• Temperature ranges
  from -55 to +200 °C

WaferTherm Chuck System
This liquid cooled system allows enormous temperature precision.

• 0.01 °C temperature step precision
• Liquid cooled Chuck System
• Temperature ranges
  from -65 to +150 °C